Tuesday, February 07, 2006

Controlling the Thermal Stability of Thin Films by Interfacial Engineering

A research group led by Prof. Tai-Chang Chiang of the University of Illinois at Urbana-Champaign has found a novel technique to effectively control thermal stability of thin films by using different and selective interfactants.

Their research results have been published in a recent issue of Physical Review Letters,

``Controlling the Thermal Stability of Thin Films by Interfacial Engineering,''
by D. A. Ricci, T. Miller, and T.-C. Chiang, Physical Review Letters, 95, 266101, (2005)

This research has attracted a lot of attention in the thin film community. One may find the related news report on lighsources.org.

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